5G Communication PCB Materials: such as PTFE, FR-408, PI, metal substrates, ceramic substrates
5G Communication PCB Materials,Due to the demand of SiP packaging design by Apple, the global upstream and downstream supply chains are moving successively. After TSMC launched 3D Fabric, ASE increased its SiP strength, and Xinxing and other plate manufacturers also greatly expanded their production capacity to meet the strong demand of FCBGA, even the international … Continued