On May 16, Shennan Circuit responded to investors’ inquiries on the investor interaction platform on “What is the main production of the Guangzhou packaging substrate production base project? When can it bring performance to the company”, and said that the company’s Guangzhou packaging substrate project is mainly for FC-BGA, FC-CSP and RF packaging substrate products. The project is currently in normal progress, the land use rights have been obtained, and the basic engineering construction has been carried out.
According to the data, Shennan Circuits was established in 1984 and has always focused on the field of electronic interconnection. After more than 30 years of deep cultivation and development, it has three businesses: printed circuit boards, electronic assembly, and packaging substrates. The company has become a leading enterprise in China’s printed circuit board industry, a pioneer in the field of packaging substrates in China, and a characteristic enterprise in electronic assembly. At present, the company has become the world’s leading wireless base station RF power amplifier PCB supplier, the domestic leading processor chip packaging substrate supplier, and a characteristic enterprise of electronic assembly manufacturing.
It is understood that in order to seize industrial development opportunities and further enhance the company’s competitiveness, Shennan Circuits invested in the construction of packaging substrate factories in Guangzhou and Wuxi. Among them, the Guangzhou packaging substrate project plans to invest 6 billion yuan, mainly for FC-BGA, RF and FC-CSP and other packaging substrates; the Wuxi high-end flip chip IC substrate product manufacturing project plans to invest 2.016 billion yuan, mainly for high-end storage and Packaging substrates such as FC-CSP are expected to be put into production in the fourth quarter of 2022.
Looking forward to 2022, Shennan Circuits said that in the packaging substrate business, the company will continue to maintain its leading edge in market segments, seize the growth opportunities in each target market, and increase the development and deepening of domestic and foreign customers in the storage and FC-CSP fields. At the same time, it will accelerate the construction of new factories in Wuxi and Guangzhou and the subsequent ramp-up of production capacity, accelerate the development of FC-BGA product technology, and incubate in depth on the basis of the existing platform.
Regarding the PCB business, Shennan printed circuit board industry stated that it will continue to ensure the leading market share in communications and further expand overseas markets; strengthen the development and introduction of new customers for data centers and automotive electronics, and at the same time do a good job in the deep cultivation of existing customers, and seize the rapid development opportunities of the industry; Actively grasp the supply of raw materials and appropriately increase the reserves of key raw materials; continue to consolidate quality control capabilities, strengthen cost control, and improve operating efficiency.