Get in touch

Factory address
Factory address: Building B, Kangjia Industrial Park, Kangle Road, Taimei Town, Boluo County, Huizhou, Guangdong Province,516000

Business office and transit warehouse address: 5th Floor, No.1 Buld, Dacheng jiancai Square, Guanchang Road, Dalingshan Town, Dongguan city, Guangdong Province, 523819
Phone number
+86 133 1296 7631

Rigid PCB

HDI Boards

Item Mass Production Sample
Build up Materials RCC,FR4 RCC,Aramid,FR4
Structure 1+N+1,2+N+2 3+N+3
Max Layer Count 1-20 22-30
Max.PCB Size 21*24in 24*28in
Copper Foil 1/3—2oz   1/3—2oz
Max. Board Thickness   3mm 3mm
Max.IVH Thickness 1.6mm 2.0mm
Min SBU Dielectric Thickness 38um 30um
Max SBU Dielectric Thickness 125um 125um
Min IVH Thickness 150um 75um
Min Core Thickness 75um 50um
Min Dieletric Thickness 50um 50um
Min Hole/Land
Inner 200/400um 200/350um
Outer 200/400um 200/350um
Max IVH Hole Size 400um 400um
Hole Location Tolerance 50um 50um
Max Laser Hole Size 250um 250um
Min Laser via/land 75/200um 75/200um
Laser Hole filling No Yes
Min Outer L/S 75/75um 50/75um
Min Inner L/S 75/75um 50/50um
Min Solder mask Dam 50um 50um
Min Solder mask Opening 50um 50um
Impedence Control +/-7% +/-5%
Warpage 0.7% 0.5%
Surface Treatment HASL Lead Free HASL Lead Free
Immersion Gold Immersion Gold
Immersion Tin Immersion Tin
Immersion Silver Immersion Silver
Flash Gold Flash Gold
OSP OSP
Gold Finger Gold Finger
Selective hard gold Selective hard gold

PTH Boards

Item Mass Production Sample
Build up Materials RCC,FR4 RCC,Aramid,FR4
Structure 1+N+1,2+N+2 3+N+3
Max Layer Count 1-20 22-30
Max.PCB Size 21*24in 24*28in
Copper Foil 0.5-6oz   0.5-6oz
Max. Board Thickness   3mm 3mm
Max.IVH Thickness 1.6mm 2.0mm
Min SBU Dielectric Thickness 38um 30um
Max SBU Dielectric Thickness 125um 125um
Min IVH Thickness 150um 75um
Min Core Thickness 75um 50um
Min Dieletric Thickness 50um 50um
Min Hole/Land Inner 200/400um 200/350um
Outer 200/400um 200/350um
Max IVH Hole Size 400um 400um
Hole Location Tolerance 50um 50um
Max Laser Hole Size 250um 250um
Min Laser via/land 75/200um 75/200um
Laser Hole filling No Yes
Min Outer L/S 75/75um 50/75um
Min Inner L/S 75/75um 50/50um
Min Solder mask Dam 50um 50um
Min Solder mask Opening 50um 50um
Impedence Control +/-7% +/-5%
Warpage 0.7% 0.5%
Surface Treatment HASL Lead Free HASL Lead Free
Immersion Gold Immersion Gold
Immersion Tin Immersion Tin
Immersion Silver Immersion Silver
Flash Gold Flash Gold
OSP OSP
Gold Finger Gold Finger
Selective hard gold Selective hard gold