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Factory address
Factory address: Zhongduan South Road, Xinfeng Industrial Park, Ganzhou City, Jiangxi Province

Business office and transit warehouse address: 5th Floor, No.1 Buld, Dacheng jiancai Square, Guanchang Road, Dalingshan Town, Dongguan city, Guangdong Province, 523819
Phone number
+86 133 1296 7631

Flexible PCB

No ItemsBest Capability
1Layer Count( Flexible PCB) 1-6L
1-4 L normal
2Board Thickness 0.1-0.5mm (1-4L)
0.6-0.8mm (5-6L)
3The tolerance of 1L board thickness (exclude stiffener) ±0.03mm
4The tolerance of 2L board thickness (<=0.3mm), exclude stiffener ±0.03mm
(Normal ±0.05mm)
5The tolerance of multilayer board thickness (<0.3mm), exclude stiffener  ±0.03mm
(Normal ±0.05mm)
6The tolerance of multilayer board thickness (0.3-0.8mm), exclude stiffener  ±10%
(Normal ±0.1mm)
7The tolerance of board thickness (include PI stiffener) ±10%
(Normal ±0.05mm)
8The tolerance of board thickness (include FR4 stiffener) ±10%
(Normal ±0.1mm)
9Max finished board size 9inch*23inch(PI≥1mil)
9inch*14inch (normal)
10Min finished board size 2mm*4mm(no connection tab);8mm*8mm(with connection tab)
11 MaterialAdhesive flex core生益 SF305: PI=0.5mil, 1mil, 2mil; Cu=0.33OZ, 0.5OZ, 1OZ
11 MaterialAdhesiveless core松下RF-775(电解):PI=1mil,2mil;Cu=0.33,oz0.5,1oz, 2oz
新扬Thinflex:PI=1mil,2mil;Cu=0.33,0.5oz,1oz
11 MaterialAdhesiveless core杜邦AP:PI=1mil,2mil,3mil,4mil;Cu=0.5oz,1oz, 2oz
11 MaterialCoverlay生益 SF305C 系列: 0515,0525,1025,1035, 2030
11 MaterialCoverlay台虹 FHK 系列: 0515, 0525, 1025, 1035, 2025
杜邦FR:0110,0210,7001,7082;
杜邦LF:0110,0210
11 MaterialThermosetting adhesive台虹系列:AD=10um,25um,40um;
11 MaterialThermosetting adhesive生益SF302B:AD=25um,40um;
11 MaterialPI stiffener台虹 MHK 系列: PI=3mil, 5mil , 7mil, 9mil
11 Material3M tape9077,9460
12 Min inner layer line width / space (before compensation)
Finished copper thickness 12um / 18um
3/3mil
12 Min inner layer line width / space (before compensation)
Finished copper thickness 35um
4/3.5mil
12 Min inner layer line width / space (before compensation)
Finished copper thickness 70um
6/5mil
13
Inner layer grid

Finished copper thickness 12um / 18um
5/5mil
(after compensation)
13
Inner layer grid

Finished copper thickness 35um
6.5/5mil
(after compensation)
13
Inner layer grid

Finished copper thickness 70um
10/8mil
(after compensation)
14
Min. Inner layer annual ring width (IPCIII, before compensation)
 4mil(<4L),7mil(4-6L),9mil(7-8L)
15
The min distance between inner layer isolated pad and copper area (before compensation)
 3.5mil
4mil normal
16 Max finished inner layer copper thickness 3oz
2 oz normal
17
The min distance between inner layer conductor and outline
 8mil
10mil normal
18Min external layer line width / space before compensation
Finished copper thickness, before compensation3/3mil
18Min external layer line width / space before compensation
Finished copper thickness 35um, before compensation3.5/3.5mil
18Min external layer line width / space before compensation
Finished copper thickness 70um, before compensation5.5/5mil
19
Min annual ring for PTH in external layer
Finished copper thickness 35um, 3mil(<2mm);4mil(2-4.5mm)
19
Min annual ring for PTH in external layer
Finished copper thickness 35-70um, 5mil(<2mm);6mil(2-4.5mm)
19
Min annual ring for PTH in external layer
Finished copper thickness >70um,7mil(<2mm);10mil(2-4.5mm)
20
Min the distance between NPTH edge to external conductor before compensation
 5mil
6mil normal
21
Max finished external copper thickness
 4oz
2 oz normal
23
Min the distance between external conductor and outline
 8mil
5mil(Gold finger area)
24Hole
The max board thickness for 0.15mm drill bit
0.8mm
24Hole
Min laser hole diameter
0.1mm
24HoleMin finish half PTH via diameter0.3mm
24HoleMin NPTH tolerance±2mil(limit+0,-2mil or +2mil,-0)
  Min space between via hole walls in different net, before compensation10mil(after compensation)
12mil (normal)(after compensation)
25
Solder mask
Solder mask bridge min. (copper thickness<=1oz)4mil(Green),5mil(White),8.0mil(big copper area)
25
Solder mask

Solder mask bridge min. (copper thickness2-4oz)
6mil,8mil(big copper area)
25
Solder mask
Solder mask opening (single side)3mil(partial2.5mil)
25
Solder mask
Solder mask opening of NPTH (single side)4mil
25
Solder mask
Min width of soldermask cover line(singleside)2.5mil
25
Solder mask
Solder mask legend width min8mil
25
Solder mask

Solder mask color
green/white/yellow
25
Solder mask
Silk screen colorwhite/yellow
27 Outline Tolerance of Laser cutting±0.05mm
28Other Impedance toleranceSingle-Ended:±5Ω(≤50Ω),±5%(>50Ω)
Difference:±3Ω(≤50Ω),±5%(>50Ω)
28OtherTolerance of stiffener  tape±0.1mm
(Normal ±0.2mm)
28OtherTolerance of Coverlay±2mil
((Normal ±4mil)
28OtherMin distance between coverlay opening and conduct3mil
((Normal 4mil)
28Other
Min. coverlay bridge 
8mil
28OtherHollowing boardFinger length≤5mm;line width≥10mil;copper thickness≥1oz
28Other Min E-test pad3mil
((Normal 4mil)
28OtherIPC Class 3Yes
28Other Min distance between E-test pads2mil
((Normal 4mil)