| No | Items | Best Capability | |
|---|---|---|---|
| 1 | Layer Count( Flexible PCB) | 1-6L 1-4 L normal | |
| 2 | Board Thickness | 0.1-0.5mm (1-4L) 0.6-0.8mm (5-6L) | |
| 3 | The tolerance of 1L board thickness (exclude stiffener) | ±0.03mm | |
| 4 | The tolerance of 2L board thickness (<=0.3mm), exclude stiffener | ±0.03mm (Normal ±0.05mm) | |
| 5 | The tolerance of multilayer board thickness (<0.3mm), exclude stiffener | ±0.03mm (Normal ±0.05mm) | |
| 6 | The tolerance of multilayer board thickness (0.3-0.8mm), exclude stiffener | ±10% (Normal ±0.1mm） | |
| 7 | The tolerance of board thickness (include PI stiffener) | ±10% (Normal ±0.05mm） | |
| 8 | The tolerance of board thickness (include FR4 stiffener) | ±10% (Normal ±0.1mm） | |
| 9 | Max finished board size | 9inch*23inch（PI≥1mil） 9inch*14inch (normal) | |
| 10 | Min finished board size | 2mm*4mm（no connection tab）；8mm*8mm（with connection tab） | |
| 11 | Material | Adhesive flex core | 生益 SF305： PI=0.5mil， 1mil， 2mil； Cu=0.33OZ， 0.5OZ， 1OZ |
| 11 | Material | Adhesiveless core | 松下RF-775(电解)：PI=1mil，2mil；Cu=0.33，oz0.5，1oz, 2oz 新扬Thinflex：PI=1mil，2mil；Cu=0.33，0.5oz，1oz |
| 11 | Material | Adhesiveless core | 杜邦AP：PI=1mil，2mil，3mil,4mil；Cu=0.5oz，1oz, 2oz |
| 11 | Material | Coverlay | 生益 SF305C 系列： 0515，0525，1025，1035, 2030 |
| 11 | Material | Coverlay | 台虹 FHK 系列： 0515， 0525， 1025， 1035, 2025 杜邦FR：0110，0210，7001,7082； 杜邦LF：0110,0210 |
| 11 | Material | Thermosetting adhesive | 台虹系列：AD=10um，25um，40um； |
| 11 | Material | Thermosetting adhesive | 生益SF302B：AD=25um，40um； |
| 11 | Material | PI stiffener | 台虹 MHK 系列： PI=3mil， 5mil ， 7mil， 9mil |
| 11 | Material | 3M tape | 9077,9460 |
| 12 | Min inner layer line width / space （before compensation) | Finished copper thickness 12um / 18um | 3/3mil |
| 12 | Min inner layer line width / space （before compensation) | Finished copper thickness 35um | 4/3.5mil |
| 12 | Min inner layer line width / space （before compensation) | Finished copper thickness 70um | 6/5mil |
| 13 | Inner layer grid | Finished copper thickness 12um / 18um | 5/5mil (after compensation) |
| 13 | Inner layer grid | Finished copper thickness 35um | 6.5/5mil (after compensation) |
| 13 | Inner layer grid | Finished copper thickness 70um | 10/8mil (after compensation) |
| 14 | Min. Inner layer annual ring width (IPCIII, before compensation) | 4mil（＜4L），7mil（4-6L），9mil（7-8L） | |
| 15 | The min distance between inner layer isolated pad and copper area (before compensation) | 3.5mil 4mil normal | |
| 16 | Max finished inner layer copper thickness | 3oz 2 oz normal | |
| 17 | The min distance between inner layer conductor and outline | 8mil 10mil normal | |
| 18 | Min external layer line width / space before compensation | Finished copper thickness, before compensation | 3/3mil |
| 18 | Min external layer line width / space before compensation | Finished copper thickness 35um, before compensation | 3.5/3.5mil |
| 18 | Min external layer line width / space before compensation | Finished copper thickness 70um, before compensation | 5.5/5mil |
| 19 | Min annual ring for PTH in external layer | Finished copper thickness 35um, | 3mil（＜2mm）；4mil（2-4.5mm） |
| 19 | Min annual ring for PTH in external layer | Finished copper thickness 35-70um, | 5mil（＜2mm）；6mil（2-4.5mm） |
| 19 | Min annual ring for PTH in external layer | Finished copper thickness >70um, | 7mil（＜2mm）；10mil（2-4.5mm） |
| 20 | Min the distance between NPTH edge to external conductor before compensation | 5mil 6mil normal | |
| 21 | Max finished external copper thickness | 4oz 2 oz normal | |
| 23 | Min the distance between external conductor and outline | 8mil 5mil（Gold finger area） | |
| 24 | Hole | The max board thickness for 0.15mm drill bit | 0.8mm |
| 24 | Hole | Min laser hole diameter | 0.1mm |
| 24 | Hole | Min finish half PTH via diameter | 0.3mm |
| 24 | Hole | Min NPTH tolerance | ±2mil(limit+0，-2mil or +2mil，-0) |
| Min space between via hole walls in different net, before compensation | 10mil(after compensation) 12mil (normal)(after compensation) | ||
| 25 | Solder mask | Solder mask bridge min. (copper thickness<=1oz) | 4mil(Green)，5mil(White)，8.0mil（big copper area） |
| 25 | Solder mask | Solder mask bridge min. (copper thickness2-4oz) | 6mil，8mil（big copper area） |
| 25 | Solder mask | Solder mask opening (single side) | 3mil(partial2.5mil) |
| 25 | Solder mask | Solder mask opening of NPTH (single side) | 4mil |
| 25 | Solder mask | Min width of soldermask cover line(singleside) | 2.5mil |
| 25 | Solder mask | Solder mask legend width min | 8mil |
| 25 | Solder mask | Solder mask color | green/white/yellow |
| 25 | Solder mask | Silk screen color | white/yellow |
| 27 | Outline | Tolerance of Laser cutting | ±0.05mm |
| 28 | Other | Impedance tolerance | Single-Ended：±5Ω(≤50Ω)，±5%(＞50Ω) Difference：±3Ω(≤50Ω)，±5%(＞50Ω) |
| 28 | Other | Tolerance of stiffener tape | ±0.1mm (Normal ±0.2mm) |
| 28 | Other | Tolerance of Coverlay | ±2mil ((Normal ±4mil) |
| 28 | Other | Min distance between coverlay opening and conduct | 3mil ((Normal 4mil) |
| 28 | Other | Min. coverlay bridge | 8mil |
| 28 | Other | Hollowing board | Finger length≤5mm；line width≥10mil；copper thickness≥1oz |
| 28 | Other | Min E-test pad | 3mil ((Normal 4mil) |
| 28 | Other | IPC Class 3 | Yes |
| 28 | Other | Min distance between E-test pads | 2mil ((Normal 4mil) |