Get in touch

Factory address
Factory address: Building B, Kangjia Industrial Park, Kangle Road, Taimei Town, Boluo County, Huizhou, Guangdong Province,516000

Business office and transit warehouse address: 5th Floor, No.1 Buld, Dacheng jiancai Square, Guanchang Road, Dalingshan Town, Dongguan city, Guangdong Province, 523819
Phone number
+86 133 1296 7631

Flexible PCB

Product Features Standard Advanced
Min Layer count 1 1
Max Layer Count 14 18
Min Board Thickness (inches) .004”Flex / .005”Rigid .002”Flex / .004”+ Rigid
Max Board Thickness (inches) .020”Flex / .093”Rigid .030”Flex / .200”Rigid
Min Core Thickness (inches) .001”Flex / .002”Rigid .0005”Flex / .002”Rigid
Min Dielectric (inches) .001”Flex / .002”Rigid .0005”Flex / .002”Rigid
Min. Starting Copper Weight 9 μm (~.35 mil) 5 μm (~.19 mil)
Max. Finished Copper Thickness (O/L) 6 oz >6 oz
Max. Finished Copper Thickness (I/L) 6 oz >6 oz
Maximum Panel Size (inches) 12″x18″ 12″x18”
Minimum Panel Size (inches) 12″x18″ 12″x18″
Smallest Mech Drill Diameter 100 μm (~3.9 mils) 100 μm (~3.9 mils)
Min Finished Hole Size 50 μm (~1.9 mils) 50 μm (~1.9 mils)
Max Thru Hole Aspect Ratio 16:01 16:01
Max Blind Via Aspect Ratio .75:1 1.2:1
Blind Via Finished Hole Size 50 μm/plated shut 50 μm/plated shut
Buried Via Finished Hole Size 50 μm (~1.9 mils) 50 μm (~1.9 mils)
Min Line Width / Line Space (microns) 25 μm (~.9 mil) 20 μm (~.78 mil)
Min Pad Size for test 75 μm (~2.9 mils) 75 μm (~2.9 mils)
Process Pad Diameter / Mech. Drill D + .010″ (1 mil annular ring) D + .007″ (Tangency)
Stacked μm vias Yes / copper filled Yes / copper filled
Minimum Wire Bond Pad size 75 μm (~2.9 mils) 75 μm (~2.9 mils)
Controlled Impedance Tolerance 10% 5%
Solder Mask Registration 50 μm LPI / 25 μm LDI 25 μm LDI
Solder Mask Feature Tolerance 25 μm (~.9 mil) 25 μm (~.9 mil)
Solder Mask Min Dam Size 75 μm (~2.9 mils) 50 μm (~1.9 mils)
Min. Diameter Rout Cutter Available .024″ .018″
Routed Part Size Tolerance .005″ .005″
Laser hole location Tolerance 12 μm (~.47 mil) 12 μm (~.47 mil)
Laser Routed Part Size Tolerance 25 μm (~.9 mil) 25 μm (~.9 mil)
Thickness Tolerance 10% <10%
Sequential Lam up to 4 cycles up to 5 cycles
Buried Vias up to 4 cycles up to 5 cycles
Micro vias Yes Yes
Conductive Filled Vias Cu filled μm vias / CB100 / Tatsuta Cu filled μm vias / CB100 / Tatsuta
Non-Conductive Filled Vias San-Ei / Peters San-Ei / Peters
Surface Finishes
ENIG Yes Yes
ENIPIG Yes Yes
Wire Bondable Gold Yes Yes
Selective Gold Yes Yes
Gold over Copper Yes Yes
Immersion Silver Yes Yes
HASL / Lead free HASL Yes Yes
Selective Copper Plating Yes Yes
Fabrication
Routed Array Yes Yes
Laser Routing Yes Yes
Mech. High Precision Routing X-Ray Pluritec System X-Ray Pluritec System
Route-edge tolerance 100 μm Laser 75 μm Laser
Route-positional tolerance 50 μm Laser 50 μm Laser
Route-edge tolerance 125 μm Mech X-Ray sys 125 μm Mech X-Ray sys
Route-positional tolerance 50 μm Mech X-Ray sys 50 μm Mech X-Ray sus
Controlled depth milling Yes Yes
Edge Plating Yes Yes
Electrical Test
Flying Probe Yes Yes
Hi Pot Yes Yes
Laminate Materials
Nelco (All series) Yes Yes
Isola (FR408, 370HR, FR06, ) Yes Yes
Arlon (All series) Yes Yes
Hitachi Yes Yes
Rogers (All 3000 and 4000 series) Yes Yes