IC substrate PCB has been developing with the booming of new types of ICs like BGA (ball grid array) and CSP (chip scale package) which call for new carriers of package. As one type of the most advanced PCB (Printed Circuit Board), IC substrate PCB has exploded in both popularity and applications together with any … Continued
Item Mass Production Sample Build up Materials RCC,FR4 RCC,Aramid,FR4 Structure 1+N+1,2+N+2 3+N+3 Max Layer Count 1-20 22-30 Max.PCB Size 21*24in 24*28in Copper Foil 1/3—2oz 1/3—2oz Max. Board Thickness 3mm 3mm Max.IVH Thickness 1.6mm 2.0mm Min SBU Dielectric Thickness 38um 30um Max SBU Dielectric Thickness 125um 125um Min IVH Thickness 150um 75um Min Core Thickness 75um … Continued
Item Capacity 1 Single and double sided SMT/PTH Yes 2 Large parts on both sides, BGA on both sides Yes 3 Smallest Chips size 0201 4 Min BGA and Micro BGA pitch and ball counts 0.008 in. (0.2mm) pitch, ball count greater than 1000 5 Min Leaded parts pitch 0.008 in. (0.2 mm) 6 Max … Continued
Product Features Standard Advanced Min Layer count 1 1 Max Layer Count 14 18 Min Board Thickness (inches) .004”Flex / .005”Rigid .002”Flex / .004”+ Rigid Max Board Thickness (inches) .020”Flex / .093”Rigid .030”Flex / .200”Rigid Min Core Thickness (inches) .001”Flex / .002”Rigid .0005”Flex / .002”Rigid Min Dielectric (inches) .001”Flex / .002”Rigid .0005”Flex / .002”Rigid Min. … Continued
HDI Boards Item Mass Production Sample Build up Materials RCC,FR4 RCC,Aramid,FR4 Structure 1+N+1,2+N+2 3+N+3 Max Layer Count 1-20 22-30 Max.PCB Size 21*24in 24*28in Copper Foil 1/3—2oz 1/3—2oz Max. Board Thickness 3mm 3mm Max.IVH Thickness 1.6mm 2.0mm Min SBU Dielectric Thickness 38um 30um Max SBU Dielectric Thickness 125um 125um Min IVH Thickness 150um 75um Min Core Thickness … Continued
SAYFU on time delivery is the second target we are commiting to customers, more than 95% on time rate is our promise to valued customers. Unit: Days 0-1m2 1-3m2 3-5m2 5-10m2 >10m2 1L 4 5 6 7 Other quote 2L 4 5 7 8 4L 5 7 9 10 6L 6 9 10 12 … Continued