Global wafer makers are actively investing in advanced manufacturing processes, and continue to move towards line pitch scaling below 28, 20 nm and 16 and 14 nm. , Among them, Xinxing plans to invest NT$10 billion in 2014, 70~80% of which will be used in the new IC carrier board factory, mainly producing FC BGA … Continued
Substrate suppliers are slashing capacity allocated to wirebond IC substrates. We hear about “limited tenting capacity,” “no support for EBS designs,” and requests for “conversion to etchback” designs. What does all this mean? Let’s start with “Line” and “Space.” “Line” is the width of a trace on a substrate and “Space” is the distance between … Continued
Looking at the current development status and trends of international electronic circuits, it is imperative to upgrade electronic circuit technology with regard to the industrial technology and policies of China’s electronic circuits-printed circuit boards. 一、Chip-scale packaging CSP will gradually replace TSOP and ordinary BGA CSP is a chip-scale package, it is not a separate form … Continued
IC substrate PCBs are mainly applied on electronic products with light weight, thinness and advancing functions, such as smart phones, laptop, tablet PC and network in fields of telecommunications, medical care, industrial control, aerospace and military. Rigid PCBs have followed through a series of innovations from multilayer PCB, traditional HDI PCBs, SLP (substrate-like PCB) to … Continued
A special circuit board for chip packaging. Similar to the traditional rigid PCB processing technology. But the smaller in size, thinner than PCB. ICS denser through holes, and finer than the traditional rigid PCB. What is IC Substrate? IC substrate is a type of base board used to package bare IC (integrate circuit) chip. Connecting … Continued