Get in touch

Factory address
Factory address: Building B, Kangjia Industrial Park, Kangle Road, Taimei Town, Boluo County, Huizhou, Guangdong Province,516000

Business office and transit warehouse address: 5th Floor, No.1 Buld, Dacheng jiancai Square, Guanchang Road, Dalingshan Town, Dongguan city, Guangdong Province, 523819
Phone number
+86 133 1296 7631

IC Substrate PCB Capabilities

CapabilitiesStandard Production
Build-up Layers3+N+3
Buried Core (reinforced)2 Layer/Multilayer, 100um thick minimum
Build-up Film Dielectric Thickness25um ~ 40um
Build-up MaterialAFT GX-series
Core Via InterconnectLaser Through Via, Mechanical Through Via
Build-up Laser Via InterconnectLaser Blind Via, 60um diameter
Core Layer Copper Thickness25um typical
Core Layer Line/Space (subtractive)40um/60um minimum
Build-up Layer Copper Thickness18um nominal (typical)
Build-up Layer Line/Space (SAP)9um/12um minimum
Solder ResistRoller Coated Liquid, Laminated Film
Surface FinishENEPIG
C4/micro-bump pitch (Pb free solder)90um minimum
Land Site Devices (chip passives)01005 minimum body size

Capabilities Of ICS

IC substrate PCB has been developing with the booming of new types of ICs like BGA (ball grid array) and CSP (chip scale package) which call for new carriers of package. As one type of the most advanced PCB (Printed Circuit Board), IC substrate PCB has exploded in both popularity and applications together with any layer HDI PCB and flex-rigid PCB, now widely applied in telecommunications and electronics updates.

IC Substrate PCB