At the recent legal meeting, Sayfu focused on IC substrates. General Manager Li Dingzhuan appeared in front of the legal person and the media, and introduced in detail how Sayfu’s layout and future growth potential were. It is understood that Li Ding went to work in Huatong, Xinxing, Xude and other big factories, and has handled most of the carrier board factories in Taiwan. He joined Sayfu in 2016.
Regarding the outlook of each product line, Li Dingzhuan said that HDI pcb and IC substrates have formulated medium and long-term plans and signed long-term capacity contracts with important customers. It is expected that both ABF and BT will have explosive growth in the future.
Chairman added that the new BT factory in Jiangmen has been contracted by major customers. ABF mainly supplies packaging factories and IC design factories, and the production capacity has also been contracted. The growth momentum brought by the IC carrier board is worth looking forward to.
HDI products include HDI pcb, IC substrates, and MiniLED. Li Dingzhuan predicts that there will be a 10-20% growth in 2022. The momentum comes from the continuous upgrading of terminal products, the continuous growth of MiniLED applications, and the active development of different terminal applications, such as automotive displays.
Chairman pointed out that SAYFU leads the industry in high-end HDI and similar substrates in terms of quality and yield. Last year, HDI contributed more than NT$20 billion, ranking third in the world.
The Rigid board PCB is mainly optimistic about the long-term infrastructure needs of 5G and the development of automobiles toward the “three modernizations”, the generational change of base stations, the servers and storage equipment required by the cloud, and the “electrification, self-driving, and interconnection” of automobiles. The kinetic energy of the board PCB is increasing year by year.
In terms of soft boards, Li Dingzhuan analyzed that this year is expected to grow by 10-15%, mainly benefiting from the development of light, thin, short and small consumer electronic products and the increase in the number of folding machines, coupled with 5G high-frequency transmission. At the same time, it is necessary to maximize the battery capacity. In addition, Metaverse AR/VR wearable products are designed to be miniaturized and lightweight. When the available space is limited, flexible boards are the best solution for these consumer electronics.
Li Dingzhuan believes that in the future, the design of flexible boards will tend to be miniaturized and multi-layered, and increasing the kinetic energy of growth will also raise the threshold. Medical, etc., the future growth of FPC will be optimistic all the way.