The development of horizontal electroplating technology is not accidental, but high density, high precision, multi-function, high aspect ratio multilayer printed circuit board products special function needs, is an inevitable result. Its advantage is that it is more advanced than the vertical hanging plating process method now adopted, the product quality is more reliable, can achieve large-scale production.
Compared with vertical electroplating process, it has the following advantages:
(1) to adapt to a wide size range, without manual mounting, to achieve all automated operations, to improve and ensure that the operation process of substrate surface no damage, to achieve large-scale production is very beneficial.
(2) In the process review, there is no need to leave a clamping position, increase the practical area, greatly save the loss of raw materials.
(3) the horizontal plating adopts full computer control, so that the substrate under the same conditions, to ensure the uniformity of each printed circuit board surface and hole coating.
(4) From the perspective of management, the automatic operation can be fully realized from the cleaning of the plating tank and the addition and replacement of the plating solution, and there will be no uncontrolled management problems caused by human error.
(5) As can be measured from the actual production, because the horizontal plating adopts multi-stage horizontal cleaning, it greatly saves the amount of cleaning water and reduces the pressure of sewage treatment.
(6) Because the system adopts closed operation, the pollution of the working space and the direct influence of heat evaporation on the process environment are reduced, and the working environment is greatly improved. Especially when drying plate, because of reducing the loss of heat, it saves the senseless consumption of energy and greatly improves the production efficiency.(horizontal electroplating technology)
The emergence of horizontal plating technology is entirely to meet the needs of high aspect ratio through hole plating. However, due to the complexity and particularity of electroplating process, there are still some technical problems in the design and development of electroplating system. This needs to be improved in practice. Nevertheless, the use of horizontal plating systems is still a great development and progress for the printed circuit industry. Because this type of equipment shows great potential in the manufacture of high-density multilayer boards, it not only saves manpower and operation time, but also produces faster and more efficiently than traditional vertical plating lines. And reduce the energy consumption, reduce the required treatment of waste liquid waste water waste gas, greatly improve the process environment and conditions, improve the quality of electroplating. Horizontal plating line is suitable for large-scale production 24 hours non-stop operation. Although the horizontal plating line is slightly more difficult than the vertical plating line when debugging, but once the debugging is completed, it is very stable. At the same time, the plating solution should be monitored at any time in the process of use, and the plating solution should be adjusted to ensure long-term stable work.