In the past ten years, our country’s electronic information industry has developed rapidly and the scale of the industry has continued to expand.
China has become the world’s largest consumer electronics market, and the upstream and downstream industrial chain fully matches the needs of the PCB industry. Mobile electronic products such as smartphones are booming, and the market for new consumer electronic products such as wearable smart devices and drones is also rapidly rising. The trend of device miniaturization and miniaturization is becoming more and more obvious.
Traditional PCBs can no longer meet product requirements. Therefore, major manufacturers have begun to study new technologies to replace PCBs. Among them, FPC, as the most popular technology, is becoming the main connection component of electronic devices.
FPC is the fastest growing sub-industry in PCB. FPC is a high-reliability and high-flexibility printed circuit board. It is made of flexible copper laminate. It is used to connect the substrate of electronic parts and is also the signal transmission medium of electronic products.
As an important category of PCB, FPC has the advantages of high wiring density, light weight, thin thickness, foldability, bending resistance, high temperature resistance, 3D wiring, etc., which is more in line with the development trend of smart portable electronic products in the downstream industry and will be widely used.