After various interpretations by all sectors of society, on the morning of April 20, the NDRC clarified the concept and scope of the new infrastructure for the first time.
In a press release from the NDRC on April 20, Wu Hao, Director of the Innovation and High-Tech Development ,Department of the NDRC, said in response to a question from Bloomberg News that the new infrastructure is guided ,by new development concepts, driven by technological innovation, and information networks The foundation, facing the needs of high-quality development, provides an infrastructure system that provides services such as digital transformation, intelligent upgrades, and integrated innovation.
For the first time, the three aspects of “new infrastructure” were clarified At present, the new infrastructure mainly includes three aspects:
One is information infrastructure. Mainly refers to the infrastructure generated based on the evolution of a new generation of information technology, such as the communication network infrastructure represented by 5G, the Internet of Things, the Industrial Internet, and the satellite Internet, and the new ones represented by artificial intelligence, cloud computing, blockchain, etc. Technical infrastructure, such as computing power infrastructure represented by data centers and intelligent computing centers.
The second is the integration of infrastructure. Mainly refers to the in-depth application of Internet, big data, artificial intelligence and other technologies to support the transformation and upgrading of traditional infrastructure, and then form a converged infrastructure, such as intelligent transportation infrastructure and smart energy infrastructure.
The third is innovative infrastructure. Mainly refers to the infrastructure with public welfare attributes supporting scientific research, technology development, product development, such as major scientific and
technological infrastructure, science and education infrastructure, industrial technology innovation infrastructure, etc.
The new infrastructures interpreted by the National Development and Reform Commission are actually wider in scope. In addition to the 5G network, data center, artificial intelligence, industrial Internet, and Internet of Things that have been explicitly mentioned in the previous official statement, cloud computing, blockchain, and intelligent computing center, which are often discussed in the industry, are also included. The high-speed rail, UHV, and new energy vehicle charging piles have not clearly appeared, but the integrated infrastructure includes intelligent transportation infrastructure and smart energy infrastructure. In addition, the statement about innovation infrastructure is clear for the first time. Major scientific and technological infrastructure, science and education infrastructure, industrial technology innovation infrastructure, etc. belong to the scope of new infrastructure.
48 trillion investment territory struck
The multiple deployments at the policy level have been sought after in the capital market, and the “new infrastructure” has recently become popular! 24 provinces opened a large investment order of 48 trillion RMB, 21 Data News Lab sorted out that as of March 5, 24 provinces and municipalities announced their future investment plans, and the total investment of 22,000 projects reached 48.6 trillion RMB. Among them, the total planned investment in 2020 is nearly 8 trillion RMB
“New infrastructure” exerts force, PCB industry may usher in rapid growth
5G is the infrastructure of the new infrastructure, and the 5G network is a prerequisite for implementing the application layer. The construction of base stations and data centers has accelerated, the corresponding PCB iterations have been upgraded, and the simultaneous upgrade of industrial Internet, Internet of Things, and consumer electronics terminals has driven the overall acceleration of the circuit board industry. High-frequency high-speed PCB is the core beneficiary of this round of new infrastructure. The upgrade of the hardware specifications of base stations and servers requires the reduction of the dielectric constant and loss value of PCB materials, and the increase in the number of components requires a high multilayer layout.
Prismark predicts that the global PCB output value in 2019 will be approximately US$63.7 billion, a year-on-year increase of 2.1%. The global PCB output value is expected to reach USD 74.756 billion in 2023. The market scale of the global PCB industry is still expanding, and the market prospects are considerable.
With the high value of high-frequency high-speed PCBs, the prosperity cycle brought by the construction of 5G base stations and relatively high technical barriers, the performance of related industry chain companies has grown rapidly. 2020 will be the first year of large-scale base station construction. . The adjustment of industrial structure, the increase in the concentration of production capacity, and the production technology of leading Chinese PCB companies will also be further improved. In the future, with the emergence of new demands such as automotive electronics, data centers, and artificial intelligence, the PCB industry will usher in new growth points.
Specifically, base station antennas, power amplifiers, automotive radars, etc. are dominated by high frequencies, while servers, base station transmission layers, etc. are dominated by high-speed materials. Material and process upgrades have significantly increased the marginal profit elasticity of core suppliers. For CCL manufacturers, base station and server PCB upgrades drive high-frequency and high-speed CCL to accelerate the volume of high- frequency, high-frequency, high-speed M4 and M6 demand. Volume and price rose.