HDI is the abbreviation of High Density Interconnect. It is a (technology) for the production of printed boards. It is currently widely used in mobile phones, digital (camcorder) cameras, MP3, MP4, etc., and is generally manufactured by build-up. The more the number of layers, the higher the technical grade of the panel. Ordinary HDI boards are basically one-time build-up. High-end HDI uses two or more build-up techniques, while using advanced PCB technologies such as stacking holes, electroplating and filling holes, and laser direct drilling. High-end HDI boards are mainly used in 3G mobile phones, advanced digital cameras, IC carrier boards, etc.
Development prospects: According to the use of high-end HDI boards-3G boards or IC carrier boards, its future growth is very rapid: the world’s 3G mobile phones will increase by more than 30% in the next few years, and China will soon issue 3G licenses; IC carrier board industry consultation The organization Prismark predicts that China’s predicted growth rate from 2005 to 2010 is 80%, which represents the direction of PCB technology development.
