Due to the demand of SiP packaging design by Apple, the global upstream and downstream supply chains are moving successively. After TSMC launched 3D Fabric, ASE increased its SiP strength, and Xinxing and other plate manufacturers also greatly expanded their production capacity to meet the strong demand of FCBGA, even the international material equipment manufacturers, which have always been conservative and cautious, also advanced deployment.
According to semiconductor industry sources, the global upstream and downstream related supply chains are moving in response to the demand for SiP package design by Apple. After TSMC launched 3D Fabric, ASE increased its SiP capabilities, and plate manufacturers such as Xinxing also expanded their production capacity to meet the strong demand for FCBGA. Even always cautious international material equipment factory also advance deployment.
Recently, it is widely rumored that the United States, Japan and Germany, including materials supplier Hitachi Chemical, surface treatment and system equipment supplier Atotech, and laser processing equipment manufacturer ESI, have formed a rare alliance to seize SiP business opportunities driven by Apple.
The semiconductor industry said that since the release of the first generation of Apple Watch in 2016, each model has integrated components such as application processor and power management chip with SiP package. The 2019 AirPods Pro is the first to carry the new H1 chip with SiP package, which has up to 10 audio cores. The internal integration of SoC, audio encoder, data converter, fully shows the advantages of low cost, high efficiency, simplified design and manufacturing process of SiP module.
It is understood that Apple continues to lead the development of SiP technology generation, the iPhone battery module design in 2021 will be SiP soft board technology, replacing the combination of soft and hard board, and is expected to undertake the new order of TSMC MacBook will also adopt the wave of SiP technology to attack. In order to keep Apple’s supply list stable, relevant global supply chains are also making technical adjustments to the trend of SiP technology development.
Among them, TSMC, which continues to promote advanced process technology, has entered the 5 nanometre process generation, 3 nanometre and 2 nanometre have also been deployed, and focuses on the integration of process technology and advanced packaging technology, expanding the advantages of one-stop manufacturing services, and keeping orders from big customers such as Apple.
At present, TSMC mainly produces CoWoS and InFO. After adopting InFO for A10 wafer of iPhone7, the overall package thickness is reduced by about 25%. TSMC is also expected to launch killer “3D Fabric” 3D IC system integrated wafer manufacturing process scheme in 2021, customers can connect multiple logic wafers together. Even connect high frequency wide memory (HBM) or small chip (Chiplet) to increase efficiency and reduce idle time.
The new process will also integrate DRAM and system single chips, further reduce the size of the motherboard, and allow the integration of radio frequency and sensor technology. TSMC will be able to secure orders from top manufacturers such as Apple, Ultramicro, NVIDIA, Qualcomm and Mediatek.
After the acquisition of Global Electronics in 2010, ASE combined its packaging technology with the module design and system integration capability of Huaxu Electronics to deepen the layout and development of SiP technology, which helped ASE maintain its leading position in the field of SiP technology and hold the orders of Apple for many years, such as Wi-Fi, processor, fingerprint identification, pressure touch control, MEMS and other modules. Bring subsequent growth impetus.
In terms of PCB supply chain, plate manufacturers such as Xinxing, Nanya, Jingshuo, etc., have actively expanded their production capacity in recent years to meet the demand for FCBGA plate in short supply. In addition, they have also synchronously arranged another wave of FCCSP plate demand caused by 5G SiP and AIP packaging.
Take Apple Watch as an example. In order to add more intelligent functions, the number of layers on the next generation SiP board will be increased, the thickness of each layer may be reduced by about 15-20%, and the aperture of the micro blind hole may be reduced by 20-30%, so as to strive for more space to integrate more components.
Under the influence of Apple, TSMC, ASE and PCB supply chains have promoted the application of SiP technology, and the upstream material and equipment supply chain has also seen an unprecedented wind of alliance. Cooperation has replaced the previous mode of single-player competition and fully initiated the development of SiP new technology products.
Therefore, it is widely reported that the supply chain recently is to solve the problem that PCB board manufacturers can not meet the needs of Apple and other chip manufacturers, SiP technology promotion is facing a bottleneck, the international material equipment manufacturers Hitachi Chemical, Atotech and American Electronics Science, etc. the United States, Japan and Germany tripartite passive to active, cross-border cooperation and strategic Alliance (Tri-Alliance) was established. We will unite our strength and strive for cooperation opportunities directly with chip manufacturers, and advance deployment to cope with the future trend changes of advanced SiP and on-board.
It is understood that the three parties are prepared in advance for thinner carrier material, smaller laser blind hole demand and more stable electroplating quality, to help customers speed up factory certification, to achieve smooth mass production of orders in the shortest time and other advantages, and to seize the huge business opportunities of 5G SiP in the next generation. People familiar with semiconductor supply chain pointed out that this alliance cooperation model is expected to become the next generation of semiconductor supply chain strategy, in order to strive for greater cooperation opportunities.
In this regard, the three companies said in a low profile that they have indeed established a cooperative alliance, mainly in response to the rapid development of SiP and other semiconductor industry technology and emerging business opportunities, alliance to expand the strength and customer base has been the trend of the global semiconductor industry chain, the details of customer and technology research and development could not be further explained.