As we know , it is easy to occur the bending for pcb in reflow oven, so let us see how to prevent this situation ?
From our engineer suggestion , i summarize the following points for your reference .
1. To reduce the effect to temperature on PCB stress .
2. To use the material with high tg value
3. To add the thickness of PCB
4. To reduce the size of PCB and the quantity of one panel
5. To use the reflow carrier tooling
6. To use Routing instead of V-Cut .