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CSP(Chip Scale Package)
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PBGA （Plastic Ball Grid Array）
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PCB Assembly with advanced SMT Technology- 6 layers Printed circuit board
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8L 2rank HDI Printed circuit board assembly for aviation project
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PCB Assembly-10 Layers Printed circuit board
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Turnkey PCB Assembly Solution-2 layers Printed circuit board
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Single sides double layers
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Aluminum substrate with insulating holes
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Electrically neutral thermal path in raised
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Double-sided Copper Base
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FPC for industrial control intercom
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High Precison 8L 2 rank HDI PCB design