The main factors affecting the quality of solder paste printing
The first is the quality of the stencil: the thickness of the stencil and the size of the opening determine the printing quality of the solder paste. Too much solder paste will cause bridging, and too little solder paste will cause insufficient solder paste or false soldering. The shape of the opening of the steel mesh and the smoothness of the opening wall also affect the demolding quality.
The second is the quality of the solder paste: the viscosity of the solder paste, the rollability of printing, and the service life at room temperature will all affect the printing quality.
Printing process parameters: there are certain restrictions between the speed and pressure of the squeegee, the angle between the squeegee and the screen, and the viscosity of the solder paste. Therefore, only by correctly controlling these parameters can the printing quality of the solder paste be guaranteed.
Equipment accuracy: When printing high-density and narrow-pitch products, the printing accuracy and repeat printing accuracy of the printer will also have a certain impact.
Ambient temperature, humidity, and environmental sanitation: Too high ambient temperature will reduce the viscosity of the solder paste. When the humidity is too high, the solder paste will absorb moisture in the air. If the humidity is too low, it will accelerate the volatilization of the solvent in the solder paste, and dust will be mixed into the tin in the environment. The paste will cause defects such as pinholes in the solder joints.
It can be seen from the above introduction that there are many factors that affect printing quality, and printing solder paste is a dynamic process.Therefore, it is very necessary to establish a complete set of printing process control documents. Choosing the correct solder paste and steel mesh, combined with the most suitable printer parameter settings, can make the entire printing process more stable, controllable and standardized.
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