IC Substrate a special circuit board for chip packaging. Similar to the traditional rigid PCB processing technology. But the smaller in size, thinner than PCB. ICS denser through holes, and finer than the traditional rigid PCB.
What is IC Substrate?
IC substrate is a type of base board used to package bare IC (integrate circuit) chip. Connecting chip and circuit board, IC belongs to an intermediate product with the following functions:
• it captures semiconductor IC chip;
• there’s routing inside to connect chip and PCB;
• it can protect, reinforce and support IC chip, providing thermal dissipation tunnel.
IC Substrate:The core hub of chip packaging
The IC substrate serves as a bridge between the chip and PCB, undertaking the triple functions of electrical connection, heat dissipation, and mechanical support. Its core value lies in achieving micrometer level line routing through high-density interconnect (HDI) technology, meeting the packaging requirements of high-performance chips such as 5G and AI.
Technological Challenges and Innovation
Material selection: The mainstream materials used are BT resin (bismaleimide triazine) or ABF (Ajinomoto Build up Film). The former has strong heat resistance, while the latter is suitable for ultrafine circuits.
Process accuracy: The line width/spacing should be controlled to be ≤ 20 μ m, and signal integrity should be ensured through processes such as laser drilling and electroplating filling.
Thermal management: Built in copper pillars or thermal conductive layers to disperse chip heat and avoid performance degradation
Application prospects
With the popularization of Chiplet technology, IC boards will develop towards multilayering (more than 10 layers) and heterogeneous integration, promoting the semiconductor industry to break through the limits of Moore’s Law.
Sayfu has been gradually growing up to a company that can fabricate IC Substrate. We are focuse on quality, cost, service, and experience continual development.
If you have any ICS-projects, send us freely, we can quote to you early. Cantact eamil: [email protected]
