IC Substrate a special circuit board for chip packaging. Similar to the traditional rigid PCB processing technology. But the smaller in size, thinner than PCB. ICS denser through holes, and finer than the traditional rigid PCB. What is IC Substrate? IC substrate is a type of base board used to package bare IC (integrate circuit) … Continued
5G PCB technology is driving the evolution of electronic devices towards higher speeds and lower latency. As the core carrier for signal transmission, the performance of PCB directly determines the operational efficiency of 5G networks. Compared with the 4G era, the millimeter wave frequency band of 5G have imposed even more stringent requirements on the … Continued
Substrate PCB are mainly applied on electronic products with light weight, thinness and advancing functions, such as smart phones, laptop, tablet PC and network in fields of telecommunications, medical care, industrial control, aerospace and military. The Integrated Circuit (IC) substrate PCB is a core component in electronics. It connects the chip to the printed circuit … Continued
The epidemic has brought prosperity to the consumer electronics industry, and the demand for LSI chips such as CPUS and Gpus has doubled. As a result, the capacity of large-size FC-BGA substrates has been in a state of shortage, leading to the lack of supply from manufacturers of packaging substrates. Fc-bga substrate is out of stock … Continued
Global wafer makers are actively investing in advanced manufacturing processes, and continue to move towards line pitch scaling below 28, 20 nm and 16 and 14 nm. , Among them, Xinxing plans to invest NT$10 billion in 2014, 70~80% of which will be used in the new IC carrier board factory, mainly producing FC BGA … Continued
Substrate suppliers are slashing capacity allocated to wirebond IC substrates. We hear about “limited tenting capacity,” “no support for EBS designs,” and requests for “conversion to etchback” designs. What does all this mean? Let’s start with “Line” and “Space.” “Line” is the width of a trace on a substrate and “Space” is the distance between … Continued
Looking at the current development status and trends of international electronic circuits, it is imperative to upgrade electronic circuit technology with regard to the industrial technology and policies of China’s electronic circuits-printed circuit boards. 一、Chip-scale packaging CSP will gradually replace TSOP and ordinary BGA CSP is a chip-scale package, it is not a separate form … Continued