Looking at the current development status and trends of international electronic circuits, it is imperative to upgrade electronic circuit technology with regard to the industrial technology and policies of China’s electronic circuits-printed circuit boards.
一、Chip-scale packaging CSP will gradually replace TSOP and ordinary BGA
CSP is a chip-scale package, it is not a separate form of packaging, but a chip-scale package called when the chip area is comparable to the package area. The CSP package allows the ratio of chip area to package area to exceed 1:1.14, which is quite close to the ideal situation of 1:1, which is about 1/3 of the ordinary BGA; the center pin form of the CSP package chip is effectively shortened The signal conduction distance reduces its attenuation, and the anti-interference and anti-noise performance of the chip can also be greatly improved. In the CSP packaging method, the chip particles are soldered on the PCB board through solder balls. The PCB board has a large contact area, so the heat generated by the chip in operation can be easily conducted to the PCB board and dissipated.
Development prospects: Chip-scale packaging developed in response to the light, thin, short and small electronic products is a new generation of packaging methods. According to the development trend of electronic products, chip-scale packaging will continue to develop rapidly and gradually replace TSOP (ThinSmallOutlinePackage) packaging and Ordinary BGA package.
