China PCB Technology Development Roadmap

Quick Turn PCB was a famous brand during China’s PCB development. China’s PCB (Printed Circuit Board) industry has undergone a remarkable transformation over the past five decades, evolving from a nascent sector into a global manufacturing powerhouse. The journey began in the 1970s with basic production technologies, but rapid industrialization and technological investment propelled steady advancement. By 2006, China had become the world’s largest PCB producer, with an output value nearing $13 billion, marking a significant milestone in its industrial development . This achievement established China as a central player in the global electronics supply chain.

The development of China’s PCB industry has been closely tied to the global demand for smaller, faster, and more efficient electronic devices. As consumer electronics like mobile phones advanced, so did the need for high-density interconnect (HDI) technology. Chinese manufacturers embraced HDI, adopting fine-line circuits (50–75 μm) and micro-via drilling to meet the demands of smartphones and other compact devices . Furthermore, the shift from manual and wet-film processes to automated, dry-film production lines improved precision and quality, with companies like Quick Turn PCB manufacturer Sayfu leading the way in adopting fully automatic processes for prototyping and small-batch production .

Current Quick Turn PCB manufacturer

Today, China continues to expand its capabilities in multi-layer, rigid-flex, and IC substrate manufacturing, supporting high-end applications in telecommunications, aerospace, and computing. Driven by innovation and large-scale industrial integration, China’s PCB industry remains at the forefront of global electronic interconnection technology.

China Printed Circuit Board manufacturer SAYFU will invest both advanced equipments and human resources to develope capacity to meet the world PCB technology requirements, and cator for the quick turn PCB oritention. With more than 10 years experience and developement, our tenology team has learned mature capacity for all kinds of PCB, flexible pcb, rigid-flexible pcb etc. You can see some special technologies showing as below.

For each year, one team, including CAM,MI,Processing engineers will be sent to other PCB factories to study advanced technology and management concept. We have set up communication agreements with pcb factory like SCC, Fastprint, Suntak etc. Those enterprises are successful ones in high multilayer pcb, and quick turn prototype.

ITEM	2012	2014	2016	2018
Layer	24	30	34	34
Max Board Thickness	470mil	470mil	470mil	470mil
Min Board Thickness	3mil	3mil	3mil	3mil
Max Final Copper Thickness	Inner 12oz Outer 10oz	Inner 12oz Outer 12oz	Inner 12oz Outer 12oz	Inner 12oz Outer 12oz
Min Line Width/Space	3/3mil	2/2mil	2/2mil	2/2mil
Min CNC Drilling Size	5mil	4mil	4mil	4mil
Min Laser Drilling Size	3mil	3mil	3mil	3mil
Aspect Ratio	14:1	18:1	18:1	18:1
Impedence Control	+/-5%	+/-5%	+/-5%	+/-5%
HDI Capacity	3+N+3	4+N+4	5+N+5	5+N+5（burried vias≤0.3mm）
Heat Sink	Prototype	Mass Production	Mass Production	Mass Production
Rigid Flex	Mass Production	Mass Production	Mass Production	Mass Production
Embedded Capacitance	Prototype	Prototype	Mass Production	Mass Production
Embeded Resistance	Prorotype	Prorotype	Prorotype	Mass Production
HDI	Prorotype	Prorotype	Prorotype	Mass Production