In PCB design, for consumer electronics or some PCB boards with high cost requirements, in order to reduce the cost, a 6-layer board design is often used, and the layout space of the device is also relatively tight, which will affect the distribution of the stack and Signal planning has higher requirements.
Generally used: SIGNAL1- GND2- SIGNAL3- SIGNAL4- POWER5-SIGNAL6 or other similar stacks.
As shown below (6-layer board):
Of course, there can be flexible workarounds for specific boards, but generally try to meet the following requirements.
- The bottom of TOP and BOTTOM is a complete power supply or ground plane;
- It is better to avoid the two signal layers being directly adjacent to each other;
- The signal layer has a better reflow plane;
- It can ensure that the key signal wiring layers such as high frequency, high speed and clock should have an adjacent reflow plane.
- Ensure the symmetry of the overall stack.
These stacking methods better satisfy the above principles.
The Core Value and Challenges of 6L PCB Design
As electronic products evolve toward higher density and performance, 6-layer PCB (Printed Circuit Board) design has become the mainstream choice for balancing cost and functionality.
Its structure typically includes signal layers, power layers, and ground layers, effectively reducing electromagnetic interference (EMI) and improving signal integrity.
Key design considerations include layer stacking planning, impedance control, and component layout, such as placing high-speed signals on inner layers to minimize crosstalk. Compared to 4-layer boards, 6L PCBs offer superior thermal performance and routing space, making them suitable for complex applications like routers and industrial control equipment.
However, design reliability must be verified using simulation tools.
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