Advanced equipments plays a pivotal role in the manufacturing of rigid-flex HDI circuit boards

Rigid-flex HDI circuit boards requires much higher precesion advanced equipments than normal PCBs,like double sided. Sayfu Group is developing such PCBs for the past 5 years and coming 10 years. So advanced equipments are must, which enables the precision, reliability, and performance required for modern electronics.

Laser drilling machines, for instance, are essential for creating microvias as small as 30–50 microns in diameter, which are critical for achieving high interconnect density in multilayer boards. Without such precision, signal integrity and thermal management would be compromised, especially in AI-driven applications where speed and minimal interference are paramount.

Moreover, Laser Direct Imaging (LDI) systems replace traditional photomasks, allowing for finer line widths and spaces (e.g., 3–5 mil traces) and tighter tolerances. This is crucial for designs with BGA components and complex routing for Rigid-flex HDI circuit boards, ensuring impedance control and reducing signal loss. Additionally, high-precision lamination and plating equipment ensure layer alignment and uniform copper deposition, which are vital for maintaining structural integrity in flexible bords sections and preventing delamination under stress.

Advanced inspection tools like AOI and impedance testers further guarantee quality by detecting defects early. Ultimately, these technologies collectively enable the miniaturization, enhanced functionality, and reliability demanded by industries such as aerospace, medical devices, and consumer electronics.

Advanced PCB equipments are very expensive expecially those imported from abroad. The competition of PCB industry is getting hotter and hotter, Sayfu management is turning its direction for high multilayer boards, only with which can we survive well and support clients well.