Definition: It is a double-sided or multi-layer circuit board made of epoxy resin and other materials. Applied disciplines: physics (first-level discipline); material physics, electricity (second-level discipline).
What is the development status and trend of difficult PCB boards in Japan’s epoxy resin printed circuit board industry? In 2007, the entire electronic circuit industry, such as printed circuit boards, packaging substrates and special processing, increased by 4.8% over the previous year, reaching 2.5173 trillion yen; of which Japan’s epoxy resin printed circuit boards (PCB) increased year-on-year. 5.0% to 1,379.9 billion yen, the largest production scale since the IT (Information Technology) bubble in 2000. Printed circuit boards are developing in the direction of high difficulty. Generally speaking, it is difficult to greatly increase the production of epoxy resin printed circuit boards (PCBs) in Japan due to the domestic demand in Japan. , digital cameras, portable products, entertainment machines and other high-functionalization, driven by this background, the production of high-density printed circuit boards has increased. Compared with last year, whether single-sided, double-sided or 4-layer multilayer boards There is a high growth in output and output value, and even low-level circuit boards are constantly developing towards high difficulty. The export situation of industrial electronic products centered on semiconductors is also very good, especially the demand for larger circuit boards for module substrates has also increased significantly following the trend last year.
In 2003, the flexible printed circuit board reached its peak, but it was in a downturn for three consecutive years, but in 2007, the multi-layer flexible printed circuit board increased by 30.6% compared with last year, and the entire flexible printed circuit increased compared with last year. 6.2%, such a high growth rate of multilayer flexible printed circuit boards shows that the target market is developing towards high density. This requires not only a stable supply of the materials used, but also the continuous development of technology. In 2007, although the module substrate did not reach the growth rate of last year, it still maintained the need for increased IC packaging substrates such as logic or storage, chip mounting combination, etc. The overall module substrate increased by 9.8% compared with last year, reaching 539.81 billion yen. The output value of all printed circuit boards reached 39.1% (37.4% in 2006 and 38% in 2005). It accounts for nearly 40% of the total output value of all printed circuits. The target of substantial and rapid growth has been achieved. Unlike printed circuit boards, module substrates are monopolized by a limited number of manufacturers. Even in the world, Japanese module substrate manufacturers have the strongest competitiveness. Since most of the customers of module substrates are overseas, this is the main reason for the good export situation. The multilayer multilayer printed circuit board market is steadily expanding every year, and is gradually infiltrating the multilayer board market. In 2007, there was also a great increase, an increase of 20.5% over the previous year, reaching a scale of 446.5 billion yen. In particular, the lamination of module substrates is obvious, and the output value in 2007 increased from 228.7 billion yen in 2006 to 294.4 billion yen. In this context, considering that electronic products will have a stronger demand for high-density circuit boards, the result must be that difficult new technologies will be concentrated in some monopoly manufacturers. It is estimated that the output value of electronic circuit substrates in 2008 will reach 1,393.8 billion yen. In 2008, the output value of epoxy resin printed circuit boards (PCB) in Japan increased by 1.0% to 1,393.8 billion yen compared with the actual performance in 2007. Since the second half of 2007, the economic situation has slowed down, and the world’s economic prosperity has also retreated. It is doubtful whether 2008 can fully The point of view of complete recovery from a state of levitating is more reasonable and appropriate.
In the first half of 2007, Japan’s epoxy resin printed circuit board (PCB) production total revenue was 494.9 billion yen (about 4.3 billion US dollars), an increase of 8.6% over the same period last year; total output fell 1.4% over the same period last year to 12.17 million square meters . This increases revenue and reduces production. In the first half of 2006, Japanese epoxy resin printed circuit board (PCB) industry managers gradually turned their attention to high-priced products to increase profits; in the second half of 2006, this business plan has been continued. The trend continued in early 2007. Manufacturers saw double-digit revenue growth while production fell more than 5%. Japanese manufacturers have reversed course in the past few months, focusing on increasing production and willing to retain market share at the expense of profits. Japanese manufacturers have adopted different marketing strategies for each product category, especially in flexible circuits. Due to the higher prices of double-sided and multi-layer circuits, manufacturers have gradually shifted from operating single-sided circuits to operating double-sided and multi-layer circuit boards.