Printed wiring board is also referred to Printed Circuit Board short for PCB, originally made from USA and now 70% more produced in China.
There are many kinds of printed wiring board products, which can be classified by substrate material, conductive graphic layer, product performance, application field and other dimensions. According to the substrate structure, it can be divided into rigid circuit board, flexible circuit board, RF circuit board and HDI circuit board.
Related Report: Beijing Puhua Youce Information Consulting Co., LTD《Special report on market segment analysis and investment prospect of Print wiring Board industry 2022-2028》
| Classification of PCB | Rigid circuit board | Flex circuit board | Flex-Rigid circuir board(9RF board) | HDI circuit board |
| Product features | Is not easy to bend, with a certain of toughness of the rigid substrate made of printed circuit board, bending ability,it can provide a certain support for the attached electronic components, including glass fiber cloth substrate, paper substrate, composite substrate, ceramic substrate, metal substrate, thermoplastic substrate and so on | Printed circuit board made of flexible insulating material, can be freely bent, wound, folded, and arbitrarily moved and expanded in three-dimensional space according to installation requirements, enabling the integration of component assembly and wire connection. Flexible board has the characteristics of high wiring density, light weight, thin thickness and small volume | In a printed circuit board contains one or more rigid area and flexible area, composed of rigid board bottom and flexible board bottom ordered laminated together, rigid flexible board can not only provide the rigid board should support, and flexible board bending, can meet the requirements of three-dimensional assembly | HDI, namely High density interconnection technology, is a kind of printed circuit board technology. HDI board is generally made of laminated method, and laser drilling technology is used to drill and conduct the laminated layer, so that the whole printed circuit board has formed a layer connection with buried and blind holes as the main conduction mode |
| Applicaion field | Widely distributed in computer and network equipment, communication equipment, industrial control, consumer electronics and automotive electronics and other industries | It is mainly used in smart phones, laptops, tablets and other portable electronic devices | It is mainly used in advanced medical electronic equipment, portable camera and foldable computer equipment | It is mainly used in consumer electronics with high density demand, including mobile phones, laptops, automotive electronics and other digital products |
| Classification fo HDI | 1 Rank HDI | 2 Rank HDI | Any Layer HDI | SLP |
| Defined | Connecting adjacent layers HDI | Connect two adjacent layers HDI | Connecting any Layer HDI | Connecting any Layer SLP |
| Line width/space(um) | >50 | >50 | 40-35 | <35 |
| Technological intoduction | The number of laser drilling layers and the number of laminate increases with the increase of the rank order |