Shennan Circuit: Guangzhou basic engineering construction project has carried out activities
On May 16, Shennan Circuit responded to investors’ inquiries on the investor interaction platform on “What is the main production of the Guangzhou packaging substrate production base project? When can it bring performance to the company”, and said that the company’s Guangzhou packaging substrate project is mainly for FC-BGA, FC-CSP and RF packaging substrate products. … Continued