| Min Layer count |
1 |
1 |
| Max Layer Count |
14 |
18 |
| Min Board Thickness (inches) |
.004”Flex / .005”Rigid |
.002”Flex / .004”+ Rigid |
| Max Board Thickness (inches) |
.020”Flex / .093”Rigid |
.030”Flex / .200”Rigid |
| Min Core Thickness (inches) |
.001”Flex / .002”Rigid |
.0005”Flex / .002”Rigid |
| Min Dielectric (inches) |
.001”Flex / .002”Rigid |
.0005”Flex / .002”Rigid |
| Min. Starting Copper Weight |
9 μm (~.35 mil) |
5 μm (~.19 mil) |
| Max. Finished Copper Thickness (O/L) |
6 oz |
>6 oz |
| Max. Finished Copper Thickness (I/L) |
6 oz |
>6 oz |
| Maximum Panel Size (inches) |
12″x18″ |
12″x18” |
| Minimum Panel Size (inches) |
12″x18″ |
12″x18″ |
| Smallest Mech Drill Diameter |
100 μm (~3.9 mils) |
100 μm (~3.9 mils) |
| Min Finished Hole Size |
50 μm (~1.9 mils) |
50 μm (~1.9 mils) |
| Max Thru Hole Aspect Ratio |
16:01 |
16:01 |
| Max Blind Via Aspect Ratio |
.75:1 |
1.2:1 |
| Blind Via Finished Hole Size |
50 μm/plated shut |
50 μm/plated shut |
| Buried Via Finished Hole Size |
50 μm (~1.9 mils) |
50 μm (~1.9 mils) |
| Min Line Width / Line Space (microns) |
25 μm (~.9 mil) |
20 μm (~.78 mil) |
| Min Pad Size for test |
75 μm (~2.9 mils) |
75 μm (~2.9 mils) |
| Process Pad Diameter / Mech. Drill |
D + .010″ (1 mil annular ring) |
D + .007″ (Tangency) |
| Stacked μm vias |
Yes / copper filled |
Yes / copper filled |
| Minimum Wire Bond Pad size |
75 μm (~2.9 mils) |
75 μm (~2.9 mils) |
| Controlled Impedance Tolerance |
10% |
5% |
| Solder Mask Registration |
50 μm LPI / 25 μm LDI |
25 μm LDI |
| Solder Mask Feature Tolerance |
25 μm (~.9 mil) |
25 μm (~.9 mil) |
| Solder Mask Min Dam Size |
75 μm (~2.9 mils) |
50 μm (~1.9 mils) |
| Min. Diameter Rout Cutter Available |
.024″ |
.018″ |
| Routed Part Size Tolerance |
.005″ |
.005″ |
| Laser hole location Tolerance |
12 μm (~.47 mil) |
12 μm (~.47 mil) |
| Laser Routed Part Size Tolerance |
25 μm (~.9 mil) |
25 μm (~.9 mil) |
| Thickness Tolerance |
10% |
<10% |
| Sequential Lam |
up to 4 cycles |
up to 5 cycles |
| Buried Vias |
up to 4 cycles |
up to 5 cycles |
| Micro vias |
Yes |
Yes |
| Conductive Filled Vias |
Cu filled μm vias / CB100 / Tatsuta |
Cu filled μm vias / CB100 / Tatsuta |
| Non-Conductive Filled Vias |
San-Ei / Peters |
San-Ei / Peters |
| Surface Finishes |
| ENIG |
Yes |
Yes |
| ENIPIG |
Yes |
Yes |
| Wire Bondable Gold |
Yes |
Yes |
| Selective Gold |
Yes |
Yes |
| Gold over Copper |
Yes |
Yes |
| Immersion Silver |
Yes |
Yes |
| HASL / Lead free HASL |
Yes |
Yes |
| Selective Copper Plating |
Yes |
Yes |
| Fabrication |
| Routed Array |
Yes |
Yes |
| Laser Routing |
Yes |
Yes |
| Mech. High Precision Routing |
X-Ray Pluritec System |
X-Ray Pluritec System |
| Route-edge tolerance |
100 μm Laser |
75 μm Laser |
| Route-positional tolerance |
50 μm Laser |
50 μm Laser |
| Route-edge tolerance |
125 μm Mech X-Ray sys |
125 μm Mech X-Ray sys |
| Route-positional tolerance |
50 μm Mech X-Ray sys |
50 μm Mech X-Ray sus |
| Controlled depth milling |
Yes |
Yes |
| Edge Plating |
Yes |
Yes |
| Electrical Test |
| Flying Probe |
Yes |
Yes |
| Hi Pot |
Yes |
Yes |
| Laminate Materials |
| Nelco (All series) |
Yes |
Yes |
| Isola (FR408, 370HR, FR06, ) |
Yes |
Yes |
| Arlon (All series) |
Yes |
Yes |
| Hitachi |
Yes |
Yes |
| Rogers (All 3000 and 4000 series) |
Yes |
Yes |
