| Item | Mass Production | Sample | |
|---|---|---|---|
| Build up Materials | RCC,FR4 | RCC,Aramid,FR4 | |
| Structure | 1+N+1,2+N+2 | 3+N+3 | |
| Max Layer Count | 1-20 | 22-30 | |
| Max.PCB Size | 21*24in | 24*28in | |
| Copper Foil | 1/3—2oz | 1/3—2oz | |
| Max. Board Thickness | 3mm | 3mm | |
| Max.IVH Thickness | 1.6mm | 2.0mm | |
| Min SBU Dielectric Thickness | 38um | 30um | |
| Max SBU Dielectric Thickness | 125um | 125um | |
| Min IVH Thickness | 150um | 75um | |
| Min Core Thickness | 75um | 50um | |
| Min Dieletric Thickness | 50um | 50um | |
| Min Hole/Land | Inner 200/400um | 200/350um | |
| Outer 200/400um | 200/350um | ||
| Max IVH Hole Size | 400um | 400um | |
| Hole Location Tolerance | 50um | 50um | |
| Max Laser Hole Size | 250um | 250um | |
| Min Laser via/land | 75/200um | 75/200um | |
| Laser Hole filling | No | Yes | |
| Min Outer L/S | 75/75um | 50/75um | |
| Min Inner L/S | 75/75um | 50/50um | |
| Min Solder mask Dam | 50um | 50um | |
| Min Solder mask Opening | 50um | 50um | |
| Impedence Control | +/-7% | +/-5% | |
| Warpage | 0.7% | 0.5% | |
| Surface Treatment | HASL Lead Free | HASL Lead Free | |
| Immersion Gold | Immersion Gold | ||
| Immersion Tin | Immersion Tin | ||
| Immersion Silver | Immersion Silver | ||
| Flash Gold | Flash Gold | ||
| OSP | OSP | ||
| Gold Finger | Gold Finger | ||
| Selective hard gold | Selective hard gold | ||