Capabilities Standard Production Build-up Layers 3+N+3 Buried Core (reinforced) 2 Layer/Multilayer, 100um thick minimum Build-up Film Dielectric Thickness 25um ~ 40um Build-up Material AFT GX-series Core Via Interconnect Laser Through Via, Mechanical Through Via Build-up Laser Via Interconnect Laser Blind Via, 60um diameter Core Layer Copper Thickness 25um typical Core Layer Line/Space (subtractive) 40um/60um minimum … Continued

Item Mass Production Sample Build up Materials RCC,FR4 RCC,Aramid,FR4 Structure 1+N+1,2+N+2 3+N+3 Max Layer Count 1-20 22-30 Max.PCB Size 21*24in 24*28in Copper Foil 1/3—2oz   1/3—2oz Max. Board Thickness   3mm 3mm Max.IVH Thickness 1.6mm 2.0mm Min SBU Dielectric Thickness 38um 30um Max SBU Dielectric Thickness 125um 125um Min IVH Thickness 150um 75um Min Core Thickness 75um … Continued

Item Capacity 1 Single and double sided SMT/PTH Yes 2 Large parts on both sides, BGA on both sides Yes 3 Smallest Chips size 0201 4 Min BGA and Micro BGA pitch and ball counts 0.008 in. (0.2mm) pitch, ball count greater than 1000 5 Min Leaded parts pitch 0.008 in. (0.2 mm) 6 Max … Continued

No  Items Best Capability 1 Layer Count( Flexible PCB) 　 1-6L1-4 L normal 2 Board Thickness 　 0.1-0.5mm (1-4L)0.6-0.8mm (5-6L) 3 The tolerance of 1L board thickness (exclude stiffener) 　 ±0.03mm 4 The tolerance of 2L board thickness (<=0.3mm), exclude stiffener 　 ±0.03mm(Normal ±0.05mm) 5 The tolerance of multilayer board thickness (<0.3mm), exclude stiffener  　 ±0.03mm(Normal … Continued